• DocumentCode
    2415181
  • Title

    An Integrated Modeling Paradigm of Circuit Reliability for 65nm CMOS Technology

  • Author

    Wang, Wenping ; Reddy, Vijay ; Krishnan, Anand T. ; Vattikonda, Rakesh ; Krishnan, Srikanth ; Cao, Yu

  • Author_Institution
    Arizona State Univ., Tempe
  • fYear
    2007
  • fDate
    16-19 Sept. 2007
  • Firstpage
    511
  • Lastpage
    514
  • Abstract
    The de facto modeling method to analyze channel-hot-carrier (CHC) is based on substrate current (Isub), which becomes increasingly problematic with technology scaling as various leakage components dominate Isub. In this work, we present a unified approach that directly predicts the change of key transistor parameters under various process and design conditions, for both negative-bias-temperature-instability (NBTI) and CHC degradation. Using the general reaction-diffusion model and the concept of surface potential, the proposed method continuously captures the performance degradation across subthreshold and strong inversion regions. Models are comprehensively verified with an industrial 65 nm technology. We benchmark the prediction of circuit performance degradation with measured ring oscillator data and simulations of an amplifier.
  • Keywords
    CMOS integrated circuits; hot carriers; integrated circuit modelling; integrated circuit reliability; surface potential; CHC degradation; CMOS technology; channel-hot-carrier; circuit reliability; de facto modeling method; general reaction-diffusion model; integrated modeling paradigm; leakage components; negative-bias-temperature-instability; ring oscillator data; size 65 nm; substrate current; surface potential; transistor parameters; CMOS technology; Circuit optimization; Degradation; Integrated circuit reliability; Integrated circuit technology; Niobium compounds; Process design; Ring oscillators; Semiconductor device modeling; Titanium compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference, 2007. CICC '07. IEEE
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-1623-3
  • Electronic_ISBN
    978-1-4244-1623-3
  • Type

    conf

  • DOI
    10.1109/CICC.2007.4405783
  • Filename
    4405783