Title :
Display driver interconnect technology for military and avionic AMLCD
Author_Institution :
Image Quest Technol. Inc., Fremont, CA, USA
Abstract :
The two most important display driver interconnect technology candidates for military and avionic AMLCD are tape automated bonding (TAB), and flip chip on glass (FCOG). These two technologies will be reviewed and compared in detail. The topics presented include: maturity of the respective technologies; infrastructure differences; known good die issues; FCOG layout issues; processing and run rate issues; reliability considerations; and FCOG rework issues
Keywords :
aircraft displays; driver circuits; flip-chip devices; lead bonding; liquid crystal displays; military avionics; reliability; tape automated bonding; IC die; TAB; avionic AMLCD; display driver; flip chip on glass; interconnect technology; layout; military AMLCD; rework; tape automated bonding; Active matrix liquid crystal displays; Aerospace electronics; Anisotropic conductive films; Anisotropic magnetoresistance; Bonding; Glass; Metallization; Production; Resins; Substrates;
Conference_Titel :
Digital Avionics Systems Conference, 1996., 15th AIAA/IEEE
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-3385-3
DOI :
10.1109/DASC.1996.559166
