• DocumentCode
    241645
  • Title

    28nm LP SoC new product bring-up for smart mobile devices

  • Author

    Yan Sun ; Jun Yuan ; Hao Wang ; Chien-Liang Chen ; Leo Kim ; Kim, Jung-Ho ; Yeap, Geoffrey

  • Author_Institution
    Qualcomm Technol. Inc., San Diego, CA, USA
  • fYear
    2014
  • fDate
    28-31 Oct. 2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Since the inception of Qualcomm´s first 28 nm LP SoC product in 2011, a series of smart mobile SoC chips have been ramped into high volume successfully. In this paper, we describe the key elements in power performance and mixed signal circuit optimization, process/device interactions, systematic yield loss reduction, and product qualification learnings. The methodical approaches are the foundations in achieving the company´s volume, cost, performance, and quality goals and enable us as the primary smart mobile chipset provider in the market today.
  • Keywords
    mixed analogue-digital integrated circuits; mobile radio; optimisation; system-on-chip; LP SoC; mixed signal circuit optimization; process-device interactions; product qualification learnings; size 28 nm; smart mobile devices; systematic yield loss reduction; Abstracts; Copper; Graphics processing units; Mobile communication; Optimization; Radio frequency;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology (ICSICT), 2014 12th IEEE International Conference on
  • Conference_Location
    Guilin
  • Print_ISBN
    978-1-4799-3296-2
  • Type

    conf

  • DOI
    10.1109/ICSICT.2014.7021245
  • Filename
    7021245