• DocumentCode
    241676
  • Title

    Ant system based 3D fixed-outline floor planning

  • Author

    Qi Xu ; Song Chen ; Bin Li

  • Author_Institution
    Dept. of Electron. Sci. & Technol., Univ. of Sci. & Technol. of China, Hefei, China
  • fYear
    2014
  • fDate
    28-31 Oct. 2014
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    The three dimension integrated circuit (3D IC) can alleviate the interconnect issue in the nanoscale era, and is promising for heterogeneous integration. In this paper, we propose a two-phase method, combining ant system algorithm (AS) and simulated annealing to handle the 3D IC floorplanning with fixed-outline constraints. We propose a floorplan construction method for AS, where blocks are packed one by one, and the partitioned sequence pair is used to represent 3D IC floorplans. During the packing procedure, we have to make two decisions: (1) selecting a block to pack and (2) finding a proper position for the selected block in the constructed partial floorplan. The AS is used to explore the appropriate orders for packing blocks. When packing a block, the best position in the partial constructed floorplan will be selected. In the AS, we use the area of a block and the connection degree between blocks to represent the heuristic information, and also modify the pheromone update rule to adapt to the 3D IC floorplanning problem. The experimental results show the effectiveness of the proposed method.
  • Keywords
    integrated circuit layout; simulated annealing; three-dimensional integrated circuits; 3D IC floorplanning; 3D fixed-outline floor planning; 3D integrated circuit; ant system algorithm; floorplan construction method; heterogeneous integration; simulated annealing; Abstracts; Through-silicon vias; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology (ICSICT), 2014 12th IEEE International Conference on
  • Conference_Location
    Guilin
  • Print_ISBN
    978-1-4799-3296-2
  • Type

    conf

  • DOI
    10.1109/ICSICT.2014.7021260
  • Filename
    7021260