Title :
How to use the big data to the technology planning: A data-driven technology roadmapping using ARM
Author :
Geum, Y. ; Lee, Hongseok ; Park, Yu-Seop
Author_Institution :
Dept. of Electr. Eng., Seoul Nat. Univ., Seoul, South Korea
Abstract :
Due to the explosive rise of data scale and scope in the business environment, the active incorporation of big data becomes an imperative and vital process in the technology roadmap. However, technology roadmapping still remains as a subjective and instinctive task conducted by some experts. Especially, the identification of relationship among different layers has been mainly dependent upon the intuitive judgment of experts. Some previous research, albeit infrequent, has attempted rather scientific approach but yet has been subject to limitations in that it remains as simply calculating the frequency of occurrence for keywords, which only provides the similarity. However, what is required to the technology roadmapping is to identify the dependency between layers. In response, this paper suggests an association rule mining (ARM)-based technology roadmap to provide both the affinity and dependency information between two layers. For this purpose, two types of indexes are measured using ARM: support and confidence. After measuring each rule, two types of maps are developed: affinity map and dependency map. For the intra-layer relationship, the affinity map is developed whereas the dependency map is constructed for the inter-layer relationship.
Keywords :
Big Data; business data processing; data mining; strategic planning; technology management; ARM-based technology roadmap; Big Data; affinity information; affinity map; association rule mining-based technology roadmapping; business environment; dependency information; dependency map; intralayer relationship; technology planning; Association rules; Big data; Business; Indexes; Planning; ARM; TRM; association rule mining; big data; roadmapping; technology roadmap;
Conference_Titel :
Industrial Engineering and Engineering Management (IEEM), 2012 IEEE International Conference on
Conference_Location :
Hong Kong
DOI :
10.1109/IEEM.2012.6837822