POD-based thermal model for FinFET IC structure

A reduced basis element method is presented based on proper orthogonal decomposition (POD) to develop thermal models for FinFET devices and integrated circuits. The POD approach is able to substantially reduce numerical degrees of freedom (DOF) while offering spatial thermal solution as detailed as detailed numerical simulation. The POD thermal models for the selected FinFET blocks can be stored in a library for constructing a larger circuit structure. This study demonstrates that, using the developed approach, an accurate thermal model for a multi-block FinFET structure can be developed to capture all the hot spots in the structure with a reduction in DOFs by nearly 6 orders of magnitude, compared to DNS.