• DocumentCode
    2418241
  • Title

    Slip prediction using Hidden Markov models: Multidimensional sensor data to symbolic temporal pattern learning

  • Author

    Jamali, Nawid ; Sammut, Claude

  • Author_Institution
    ARC Centre of Excellence for Autonomous Syst., Univ. of New South Wales, Sydney, NSW, Australia
  • fYear
    2012
  • fDate
    14-18 May 2012
  • Firstpage
    215
  • Lastpage
    222
  • Abstract
    We present experiments on the application of machine learning to predicting slip. The sensing information is provided by a force/torque sensor and an artificial finger, which has randomly distributed strain gauges and polyvinylidene fluoride (PVDF) films embedded in silicone resulting in multidimensional time-series data on the finger-object contact. An incipient slip is detected by studying temporal patterns in the data. The data is analysed using probabilistic clustering that transforms the data into a sequence of symbols, which is used to train a hidden Markov model (HMM) classifier. Experimental results show that the classifier can predict a slip, at least 100ms before a slip takes place, with an accuracy of 96% on the validation set.
  • Keywords
    control engineering computing; data analysis; dexterous manipulators; force sensors; hidden Markov models; learning (artificial intelligence); pattern classification; probability; silicones; time series; artificial finger; data analysis; dexterous manipulation; distributed strain gauge; finger-object contact; force sensor; hidden Markov model classifier; incipient slip detection; machine learning; multidimensional sensor data; multidimensional time-series data; polyvinylidene fluoride film; probabilistic clustering; sensing information; silicone; slip prediction; symbolic temporal pattern learning; torque sensor; Clustering algorithms; Force; Hidden Markov models; Principal component analysis; Robot sensing systems; Training;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Robotics and Automation (ICRA), 2012 IEEE International Conference on
  • Conference_Location
    Saint Paul, MN
  • ISSN
    1050-4729
  • Print_ISBN
    978-1-4673-1403-9
  • Electronic_ISBN
    1050-4729
  • Type

    conf

  • DOI
    10.1109/ICRA.2012.6225207
  • Filename
    6225207