• DocumentCode
    2418331
  • Title

    The change of microstructure of large stator winding insulation in multi-stress aging

  • Author

    Jia, Zhidong ; Xie, Hengkun

  • Author_Institution
    Tsinghua Univ., Beijing, China
  • fYear
    2002
  • fDate
    7-10 Apr 2002
  • Firstpage
    49
  • Lastpage
    52
  • Abstract
    The epoxy mica insulation system has been in service as the main insulation of large generators since 1960s. The real stator bars of 18 kV/300 MW generator were used for accelerated multi-stress aging experiments to investigate the changes in the microstructure of the epoxy mica insulation. The stator insulation of large generator is composed of epoxy resin, mica and fiberglass. Study of the interface of the composite is significant for overall comprehension of its properties. A scanning electronic microscope was used to observe the pattern of the interface during the aging process, and it was found that a change in interface was the main reason of aging. The variation of components in insulation was also analyzed by the technique of infrared spectrum and X-ray energy spectrum. The results show that hydrolytic reaction occurred in the epoxy resin and the mica undergoes structural change.
  • Keywords
    ageing; composite insulating materials; crystal microstructure; electric generators; epoxy insulation; infrared spectroscopy; insulation testing; machine insulation; mica; scanning electron microscopy; stators; 18 kV; 300 MW; X-ray energy spectrum; accelerated multi-stress aging; epoxy mica insulation; epoxy mica insulation system; epoxy resin; fiberglass; generators; hydrolytic reaction; infrared spectrum; mica; microstructure; multi-stress aging; scanning electronic microscope; stator bars; stator winding insulation; Aging; Conducting materials; Epoxy resins; Insulation testing; Microstructure; Scanning electron microscopy; Stator bars; Stator windings; Thermal stresses; Vibrations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 2002. Conference Record of the 2002 IEEE International Symposium on
  • Print_ISBN
    0-7803-7337-5
  • Type

    conf

  • DOI
    10.1109/ELINSL.2002.995878
  • Filename
    995878