Title :
A mini UHF tag with on chip antenna based on gold bump process
Author :
Hongwei, S. ; Huijun, C. ; Yuhui, H.
Author_Institution :
CEC Huada Electron. Design Co., Ltd., Beijing, China
Abstract :
A novel fully integrated UHF tag with on chip antenna (OCA) is proposed in this paper. The OCA was fabricated on the passivation substrate using a normal gold bumping process. The near field coupling between the OCA and the reader loop-antenna and the optimization of OCA are also presented. A 7 turns OCA with 8.88+j98.6Ω impedance was bumped to a tag chip which has -12dBm sensitivity with a normal dipole antenna. A 2mm read distance was achieved using a 24 dBm output power reader with a 3mm-radius loop antenna. The chip area was 0.8 × 0.8 mm2 fabricated in TSMC 0.18um CMOS mixed signal process.
Keywords :
dipole antennas; loop antennas; radiofrequency identification; CMOS mixed signal process; OCA; near field coupling; normal dipole antenna; normal gold bumping process; novel fully integrated UHF tag; on chip antenna; optimization; reader loop-antenna; Coils; Couplings; Dipole antennas; Gold; Impedance; Sensitivity; gold bump; mini tag; on chip antenna;
Conference_Titel :
Solid-State and Integrated Circuit Technology (ICSICT), 2014 12th IEEE International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4799-3296-2
DOI :
10.1109/ICSICT.2014.7021360
