• DocumentCode
    2418802
  • Title

    Virtual soldering environment using touch and gesture for engineering labs education

  • Author

    Venkittarayan, C. ; Jayaprakash ; Gopal, V. Madan ; Kartikkumar, Rao ; Nitin, B.S. ; Madan, Nitin ; Rajamani, Kumar ; Achyutan, Krishnashree ; Bijlani, Bhavani

  • Author_Institution
    Sch. of Eng., Inf. Technol., Amrita Univ., Bengaluru, India
  • fYear
    2010
  • fDate
    3-4 April 2010
  • Firstpage
    206
  • Lastpage
    210
  • Abstract
    Labs form a central component especially in engineering education. The objective of our current work is to enhance the possibility of teaching, learning and experiencing engineering lab targeted towards teachers and students of various disciplines in engineering. This is achieved by developing virtual computer based lab environments. The experience of these environments is enriched with touch based technology. This paper talks about creation of virtual soldering environment. We have successfully implemented a working prototype which would enable the end user to get a feel for real time soldering. This approach of `virtual´ computer based training environment has great potential that stimulates self-learning process of soldering.
  • Keywords
    computer aided instruction; electrical engineering education; laboratory techniques; printed circuits; soldering; virtual reality; PCB; central component; engineering labs education; gesture; real time soldering; self learning process; touch; virtual soldering environment; Application software; Computer science; Computer science education; Design engineering; Educational technology; Electronic learning; Haptic interfaces; Information technology; Soldering; Space technology; Engineering Labs; Haptics; PCB; Touch Sensitive; Touch based technology; Virtual Soldering; Virtual training environment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Students' Technology Symposium (TechSym), 2010 IEEE
  • Conference_Location
    Kharagpur
  • Print_ISBN
    978-1-4244-5975-9
  • Electronic_ISBN
    978-1-4244-5974-2
  • Type

    conf

  • DOI
    10.1109/TECHSYM.2010.5469179
  • Filename
    5469179