DocumentCode :
241908
Title :
Impact of N plasma treatment on the Current collapse of ALGAN/GAN HEMTs
Author :
Zhihua Dong ; Ronghui Hao ; Zhili Zhang ; Yong Cai ; Baoshun Zhang ; Zhiqun Cheng
Author_Institution :
Sch. of Electron. & Inf., Hangzhou Dianzi Univ., Hangzhou, China
fYear :
2014
fDate :
28-31 Oct. 2014
Firstpage :
1
Lastpage :
3
Abstract :
The impact of N- plasma treatment before SiNx deposition on current collapse of AlGaN/GaN HEMTs was studied. N- plasma treatment of 1, 2 and 5 minutes was performed before SiNx deposition with plasma enhanced chemical vapor deposition (PECVD). It is found current collapse changed with three kinds of schemes. Apparent differences occurred with treatment time. The Current lags of the sample with treatment of 1 minute degenerated to 65.45%, compared with the current lag without any N- plasma treatment and passivation. While the value of the samples with treatment of 2 and 5 minutes changed to 58.11% and 30.44%, indicating N- plasma treatment before SiNx passivation is benefit to depress current collapse. The reason is suggested to be the N- plasma treatment caused reduction of interface states, which is probably originate from some kind of defects related nitrogen.
Keywords :
III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; passivation; plasma CVD; silicon compounds; wide band gap semiconductors; AlGaN-GaN; HEMT; N- plasma passivation; N- plasma treatment; PECVD; SiNx; SiNx deposition; SiNx passivation; current collapse; current lags; plasma enhanced chemical vapor deposition; Abstracts; Aluminum gallium nitride; Current measurement; Educational institutions; Gallium nitride; HEMTs; MODFETs;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuit Technology (ICSICT), 2014 12th IEEE International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4799-3296-2
Type :
conf
DOI :
10.1109/ICSICT.2014.7021380
Filename :
7021380
Link To Document :
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