• DocumentCode
    2419917
  • Title

    Investigations of the thrombogenic and cavitational potentials of a bileaflet mechanical heart valve, using ANSYS-CFX

  • Author

    Turcu, A.E. ; Rafiroiu, D.V. ; Diaz-Zuccarini, V. ; Narracott, A.J. ; Hose, D.R. ; Lawford, P.V.

  • Author_Institution
    Tech. Univ. of Cluj-Napoca, Cluj-Napoca
  • Volume
    3
  • fYear
    2008
  • fDate
    22-25 May 2008
  • Firstpage
    106
  • Lastpage
    111
  • Abstract
    Detailed flow dynamic analysis in the vicinity of the leaflets and the housing during the valve-closure phase (including the rebound) is of interest for the assessment of both the thrombogenic and the cavitational potential of a candidate valve. A newly developed lumped parameter model of the left ventricle contraction and a computational fluid dynamics (CFD) representation of the fluid structure interaction (FSI) are coupled, allowing for the investigation of the valve closure under different conditions. The platelet activation potential is related to the velocity profile in the clearance region and to the duration for which the platelets are exposed to wall shear stress (WSS). The cavitational potential is related to the negative pressure transients at the leaflet edge and to the vorticity of the flow during valve closure and rebound.
  • Keywords
    biological fluid dynamics; cardiology; computational fluid dynamics; medical computing; prosthetics; ANSYS-CFX; bileaflet mechanical heart valve; cavitational potential; computational fluid dynamics; flow dynamic analysis; fluid structure interaction; left ventricle contraction; lumped parameter model; platelet activation potential; thrombogenic potential; valve-closure phase; wall shear stress; Boundary conditions; Computational fluid dynamics; Educational institutions; Fluid dynamics; Heart valves; Implants; Medical treatment; Partial differential equations; Stress; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Automation, Quality and Testing, Robotics, 2008. AQTR 2008. IEEE International Conference on
  • Conference_Location
    Cluj-Napoca
  • Print_ISBN
    978-1-4244-2576-1
  • Electronic_ISBN
    978-1-4244-2577-8
  • Type

    conf

  • DOI
    10.1109/AQTR.2008.4588892
  • Filename
    4588892