High dielectric constant polymer-ceramic composite for embedded capacitor application

Integral passive components can reduce assembly cost and improve electrical performance as compared with traditional discrete passive components. Developing a suitable material that satisfies electrical, reliability, and processing requirements is one of the major challenges of incorporating passives into a print wire board (PWB). Polymer-ceramic composites have been of as much interest as integral capacitor materials because they combine the processability of polymers with the desired electrical properties of ceramics. In this work a polymer-ceramic composite with very high dielectric constant (ε_r=89) has been developed for embedded capacitor application. High dielectric constant material is obtained by increasing the dielectric constant of the epoxy matrix (ε_r~5) and using the combination of PMN-PT/BaTiO₃ as ceramic fillers. The effect of the composite microstructure on the effective dielectric constant has been studied