Thermal analysis of multiple light sources based on the superposition method

In this paper, the superposition method is used to investigate the complete temperature field of a package with multiple chips and a module with multiple packages, based on the results of transient temperature rise measurements and the thermal resistance coupling matrix. In the case of a package with multiple chips, such as a RGBW LED package with four chips inside, the different power and TSP (temperature sensitive parameter) cause the uneven temperature distribution, while in other case of an array with 16 packages also dose because of separation distance and distribution. It was shown that the thermal resistance coupling matrix can provide relatively accurate and reliable self-heating and coupling temperature rise data.