Title :
Adhesion studies of polyimide-epoxy interfaces in flip chip assemblies
Author :
Pearson, R.A. ; Lloyd, T.B.
Author_Institution :
Microelectron. Packaging Mater. Lab., Lehigh Univ., Bethlehem, PA, USA
Abstract :
The adhesive strength between underfill resins and organic passivation layers is controlled by the molecular interactions occurring at the interface and the plastic deformation mechanisms occurring in the underfill resin. Therefore, improvement in reliability can be realized by selecting tough underfill resins with the proper chemistry to interact with the specific organic passivation layer chosen. Surface treatment of the organic passivation coating can improve adhesion in cases were the inherent molecular interactions are weak
Keywords :
adhesives; encapsulation; flip-chip devices; integrated circuit reliability; passivation; plastic deformation; adhesive strength; flip chip assemblies; molecular interactions; organic passivation layers; plastic deformation mechanisms; polyimide-epoxy interfaces; reliability; surface treatment; underfill resins; Adhesives; Assembly; Dispersion; Flip chip; Microelectronics; Packaging; Polyimides; Polymers; Probes; Thermodynamics;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-930815-59-9
DOI :
10.1109/ISAPM.2000.869243
