Three-dimensional integration of high frequency DC/DC converters based on LTCC technology

This paper explores some strategies of incorporating advantages of low temperature co-fired ceramic (LTCC) technology into design and fabrication of low power high frequency DC/DC converters. High power density and high efficiency are two key factors for power modules. The development of new generation power switches with much less turn-on and turn-off time interval provides new chances for increasing switching frequency and reducing volume of passives, this makes LTCC technology which is commonly used in RF circuit applicable for fabrication and integration of high frequency DC/DC converters. Conductor paste, ceramic tapes, ferrite tapes, capacitor tapes as well as metal substrates are co-fired together to realize three-dimensional inter-connection, passive integration, thermal performance improvement and structure optimization.