DocumentCode :
2420768
Title :
A 2.5-watt high frequency X-band power MMIC
Author :
Avasarala, M. ; Day, D.S. ; Chan, S. ; Hua, C. ; Basset, J.R.
Author_Institution :
Avantek Inc., Santa Clara, CA, USA
fYear :
1989
fDate :
12-13 June 1989
Firstpage :
25
Lastpage :
28
Abstract :
The design and performance of a two-stage molecular-beam epitaxy (MBE) monolithic power amplifier chip is presented. The monolithic chip contains full interstage matching, partial matching at the input, and no match at the output. When matched to 50 Omega at input and output using off-chip circuitry, the MMIC demonstrates an overall performance of 34 dBm (0.436 W/mm) of power, 36% of power-added efficiency (PAE), and 14.5 dB of associated gain across the band 9.0-10.0 GHz. The PAE was as high as 38% in parts of the band. The average performance of 26 devices from at least 12 wafers from 5 different runs is 33.6 dBm (0.4 W/mm), 32%, and 14 dB, respectively. The chip size is 0.081 in*0.070 in*0.003 in (2.06 mm*1.78 mm/sup 2/).<>
Keywords :
MMIC; field effect integrated circuits; impedance matching; microwave amplifiers; power amplifiers; power integrated circuits; 14.5 dB; 2.5 W; 36 percent; 70 to 81 mil; 9 to 10 GHz; MBE; SHF; X-band; gain; interstage matching; molecular-beam epitaxy; performance; power MMIC; power amplifier chip; power-added efficiency; Assembly; Circuits; Costs; FETs; Fingers; Frequency; Impedance matching; MMICs; Phased arrays; Size control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave and Millimeter-Wave Monolithic Circuits Symposium, 1989. Digest of Papers., IEEE 1989
Conference_Location :
Long Beach, CA, USA
Type :
conf
DOI :
10.1109/MCS.1989.37255
Filename :
37255
Link To Document :
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