• DocumentCode
    2421024
  • Title

    Non-destructive diagnostic facilities for cable systems

  • Author

    Cornelissen, C. ; Schnettler, Armin

  • Author_Institution
    Inst. for High Voltage Technol., Aachen, Germany
  • fYear
    2002
  • fDate
    7-10 Apr 2002
  • Firstpage
    557
  • Lastpage
    560
  • Abstract
    Polymeric materials like polyethylene and silicone rubber used in cables, joints and terminations show an electrical aging behavior. Considering the consequences of dielectric aging, effective diagnostic facilities are currently required, which have to be primarily nondestructive and which should detect as many faults as possible. Based on previous experiences it can be expected, that ultrasonic measurements and nuclear magnetic resonance (NMR) investigations fulfill these requirements. In addition the possible use of these facilities for quality management is presently being investigated. The increasing miniaturization, combined with the possible application of mobile diagnostic devices, is taken into account. First results show the feasible use of these facilities for detecting inhomogeneities like impurities and electrical trees in the insulation material and for identifying variations of the cross-link density.
  • Keywords
    ageing; cable insulation; cable jointing; cable testing; electric connectors; insulation testing; nondestructive testing; nuclear magnetic resonance; trees (electrical); cables joints; cables terminations; cross-link density variations; diagnostic facilities; dielectric aging; electrical aging behavior; electrical trees; insulation impurities; nondestructive cable diagnostic facilities; nuclear magnetic resonance; polyethylene; quality management; silicone rubber; Aging; Cables; Dielectric materials; Dielectric measurements; Electrical fault detection; Joining materials; Nuclear magnetic resonance; Polyethylene; Polymers; Rubber;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 2002. Conference Record of the 2002 IEEE International Symposium on
  • Print_ISBN
    0-7803-7337-5
  • Type

    conf

  • DOI
    10.1109/ELINSL.2002.996000
  • Filename
    996000