Title :
Hygroscopic behavior and in-line thermo-mechanical treatment of polymeric material effects on PBGA warpage
Author :
Wu, Jim C L ; Liang, Morris ; Le, Anhtuan ; Chen, Zine ; Wu, Sting ; Lo, Kenny ; Lee, Alex
Author_Institution :
Adv. Semicond. Eng Inc., Kaohsiung, Taiwan
Abstract :
The interaction of hygroscopic behavior and thermo-mechanical treatment of polymeric material is highly interesting, not only from the warpage and coplanarity point of view but also from the in-plane deformation characteristics. Since the moisture absorption of substrates has been classified as one of the indicators to qualify package materials, in this study, package warpage relating the substrate quality and package process flow was addressed. The package size effect on package warpage and coplanarity was examined The hygroscopic behavior of plastic packages on warpage was investigated by two different storage patterns such as dry packing and on-floor exposure. Moreover, the in-line thermo-mechanical treatment (clamping) effect on warpage vs. hygroscopic behavior was discussed. Finally, from Moire interferometry, the fringe patterns of specimens with and without clamping and before and after soaking were compared. It is shown that clamping is able to control the warpage successfully.
Keywords :
ball grid arrays; light interferometry; moisture; moulding; plastic deformation; plastic packaging; reliability; surface mount technology; thermal stresses; thermomechanical treatment; DMA; Moire interferometry; PBGA warpage; clamping effect; coplanarity; dry packing; fringe patterns; hygroscopic behavior; inline thermo-mechanical treatment; inplane deformation characteristics; moisture absorption; mold compound; on-floor exposure; package process flow; package size effect; package warpage; polymeric material effects; soaking; solder mask; substrate quality; warpage control; Assembly; Clamps; Electronics packaging; Microassembly; Moisture; Plastic packaging; Polymers; Substrates; Thermal stresses; Thermomechanical processes;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on
Conference_Location :
Braselton, GA, USA
Print_ISBN :
0-930815-59-9
DOI :
10.1109/ISAPM.2000.869279