DocumentCode :
2421210
Title :
Investigating molecular interactions between underfill resins and organic passivator layers via flow microcalorimetry
Author :
Pearson, R.A. ; Welsh, D.J. ; Lloyd, T.B.
Author_Institution :
Microelectron. Packaging Mater. lab., Lehigh Univ., Bethlehem, PA, USA
fYear :
2000
fDate :
2000
Firstpage :
285
Lastpage :
288
Abstract :
Contact angle measurements and flow microcalorimetry are two methods being investigated at Lehigh University, for their use in probing surfaces to look at acid-base interactions and strength of molecular interactions at interfaces. The practical adhesion between two phases depends on both the mechanical and energetic interfacial interactions of the phases. The energetic interaction may be divided into the dispersion and the acid-base interactions. In this paper the techniques are applied to interfaces between underfill resins and organic passivator layers
Keywords :
adhesion; calorimetry; contact angle; encapsulation; organic compounds; passivation; polymer films; acid-base interaction; adhesion; contact angle measurement; dispersion interaction; flow microcalorimetry; interfacial interaction; molecular interaction; organic passivator layer; underfill resin; Data analysis; Equations; Fluid flow measurement; Goniometers; Liquids; Polymers; Powders; Probes; Resins; Solvents;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-930815-59-9
Type :
conf
DOI :
10.1109/ISAPM.2000.869286
Filename :
869286
Link To Document :
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