DocumentCode :
2421609
Title :
Microstructure Fabrication with Conductive Paste Dispensing
Author :
Itoh, Toshihiro ; Suga, Tadatomo ; Kataoka, Kenichi ; Sano, Toshio
Author_Institution :
Dept. of Precision Eng., Tokyo Univ.
fYear :
2007
fDate :
16-19 Jan. 2007
Firstpage :
1003
Lastpage :
1007
Abstract :
We report on a fabrication technique that realizes 3-dimensionaI microstructures made of conductive pastes and mechanical and electrical properties of the fabricated microstructures. In the technique, ultra precise dispensing of low-temperature silver pastes on a heated substrate is continuously repeated and variable microstructures with a diameter of as small as 20 micrometers such as high posts, cantilevers and zigzag shapes can be successfully fabricated. The mechanical and electrical properties of the fabricated microcantilevers have been investigated and it has been found that their probing resistance with a low contact force of 1 mN can be lower than 1 Omega by utilizing appropriate heat curing and fritting processes.
Keywords :
cantilevers; conductive adhesives; electric properties; mechanical properties; micromechanical devices; silver; 3D microstructures; Ag; conductive paste dispensing; electrical properties; fritting process; heat curing process; mechanical properties; microcantilevers; microstructure fabrication; silver pastes; Contacts; Fabrication; Integrated circuit interconnections; Integrated circuit packaging; Microstructure; Probes; Silver; Springs; Substrates; Testing; MEMS packaging; conductive paste; dispensing; fritting; microspring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nano/Micro Engineered and Molecular Systems, 2007. NEMS '07. 2nd IEEE International Conference on
Conference_Location :
Bangkok
Print_ISBN :
1-4244-0610-2
Type :
conf
DOI :
10.1109/NEMS.2007.352187
Filename :
4160490
Link To Document :
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