Modified process control chart in IC fabrication using clustering analysis

Summary form only given as follows. During the complicated production process in integrated circuit (IC) fabrication, various types of defects on wafer surface are unavoidable. As the wafer size increases, the clustering phenomenon of the defects becomes increasingly apparent. To upgrade the yield and reliability of IC products, statistical process control (SPC) is practiced to track a manufacturing process. However, the clustered defects frequently cause many false alarms when the standard control charts for defects is used. In this study, we propose a method for constructing defect control charts for processes that yield clustered defects. A case study is also evaluated, indicating that the proposed method produces satisfactory control charts for the defect data in IC fabrication