• DocumentCode
    2423090
  • Title

    Influence of moisture on dielectric strength in polyamide (aramid) paper

  • Author

    Ul-Haq, Saeed

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Windsor Univ., Ont., Canada
  • fYear
    2003
  • fDate
    19-22 Oct. 2003
  • Firstpage
    325
  • Lastpage
    328
  • Abstract
    This paper presents the influence of absorbed moisture and variation in environmental temperature on DC breakdown strength in 125 μm polyamide (aramid) paper. Polyamide (aramid) paper also known as Nomex® type 410 is widely used in a majority of electrical equipment applications. The combination of electrodes used for the investigation of breakdown strength was of diameter 12.5mm and 50mm. Specimens A-D, used for the investigation were prepared under four different environmental conditions. It is concluded that the electrical behavior of these material varies both with the environmental temperature and with the absorbed moisture. Variations in the breakdown strength were observed between 5.5-15.5% for specimens A-C, where as tremendous drop in the electrical breakdown strength was recorded for specimen D. The breakdown results were presented by using two-parameter Weibull statistical distribution. The statistical analysis was performed on large population of data, which leads to an effective design of electrical insulation.
  • Keywords
    electric breakdown; electric strength; environmental degradation; moisture; paper; polymer films; sorption; DC breakdown strength; absorbed moisture; calendered insulation paper; dielectric strength; environmental temperature; moisture influence; polyamide paper; synthetic meta-aramid polymer; two-parameter Weibull distribution; Conducting materials; Dielectric breakdown; Dielectric thin films; Dielectrics and electrical insulation; Electric breakdown; Electrodes; Moisture; Power transformer insulation; Solids; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 2003. Annual Report. Conference on
  • Print_ISBN
    0-7803-7910-1
  • Type

    conf

  • DOI
    10.1109/CEIDP.2003.1254859
  • Filename
    1254859