DocumentCode
2423116
Title
Space charge distribution before breakdown of polyimide film by short interval measurement with PEA method
Author
Muramoto, Y. ; Fukuma, M. ; Mitsumoto, S. ; Hozumi, N. ; Nagao, M. ; Shimizu, N.
Author_Institution
Meijo Univ., Nagoya, Japan
fYear
2003
fDate
19-22 Oct. 2003
Firstpage
329
Lastpage
332
Abstract
We have been studying the breakdown characteristics of polyimide (PI) films. The purpose of this study is to clarify the effect of space charge and conduction current on breakdown mechanism of PI. The space charge distributions and external circuit current (lex) were simultaneously measured just before the breakdown of a 125 μm thick PI film by using pulsed electro-acoustic (PEA) method in 90°C. We tried to observe the change of space charge distribution just before the breakdown of PI films obtained by very short period interval (2 ms) measurement. The space charge distribution just before the breakdown did not show a noticeable change. These results showed that the breakdown of PI films is not directly caused by the distortion of the electric field before 2 ms at the breakdown, but is caused by a thermal breakdown process due to the conduction current by the temperature rise of sample. The simultaneous measurement of transient space charge profiles and lex must contribute to the investigation of conduction and breakdown phenomena of PI films.
Keywords
electric breakdown; insulating thin films; insulation testing; polymer films; pulsed electroacoustic methods; space charge; 90 C; breakdown characteristics; external circuit current; polyimide film; pulsed electroacoustic method; short interval measurement; space charge distribution; thermal breakdown; time dependence; transient space charge profiles; Charge measurement; Conductive films; Current measurement; Distortion measurement; Electric breakdown; Polyimides; Pulse measurements; Space charge; Thick film circuits; Thickness measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena, 2003. Annual Report. Conference on
Print_ISBN
0-7803-7910-1
Type
conf
DOI
10.1109/CEIDP.2003.1254860
Filename
1254860
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