DocumentCode :
2423151
Title :
Computation of electro-thermal breakdown of polymer films
Author :
Qi, Xiaoguang ; Zheng, Zhoug ; Boggs, Steven
Author_Institution :
Electr. Insulation Res. Center, Univ. of Connecticut, CT, USA
fYear :
2003
fDate :
19-22 Oct. 2003
Firstpage :
337
Lastpage :
340
Abstract :
Development of new polymer films is impeded by the need to make large quantities of high quality film for prototype devices. However, DC breakdown should be predictable from material electrothermal properties, i.e., field and temperature dependent electrical conductivity, thermal diffusivity, and boundary conditions. Transient nonlinear finite element analysis readily predicts thermal runaway of a polymer film between metal electrodes. In this contribution, we evaluate analytical approaches to this problem in the context of laboratory testing between metal electrodes. The objective is to predict approximate limits to device performance as a function of electric field and temperature from measurements on prototype materials.
Keywords :
electric breakdown; finite element analysis; polymer films; thermal diffusivity; DC breakdown; approximate limits; boundary conditions; device performance; electrothermal breakdown; field dependent electrical conductivity; heat balance equation; large positive thermal feedback; metal electrodes; polymer films; quasi-steady state approximation; temperature dependent electrical conductivity; thermal diffusivity; thermal runaway; transient nonlinear finite element analysis; Conducting materials; Electric breakdown; Electrodes; Electrothermal effects; Impedance; Polymer films; Prototypes; Temperature dependence; Temperature measurement; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 2003. Annual Report. Conference on
Print_ISBN :
0-7803-7910-1
Type :
conf
DOI :
10.1109/CEIDP.2003.1254862
Filename :
1254862
Link To Document :
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