• DocumentCode
    2423753
  • Title

    Single event effects and prompt dose hardness of a deep submicron commercial process

  • Author

    Benedetto, Joseph M.

  • Author_Institution
    Aeroflex UTMC, Colorado Springs, CO, USA
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    58
  • Lastpage
    61
  • Abstract
    A single event effects and prompt dose hardened 0.25 μm CMOS process has been developed using the WaferTech commercial foundry. The hardness was achieved solely using design-hardening techniques, i.e. no process changes were added or removed from the commercial flow.
  • Keywords
    CMOS integrated circuits; integrated circuit design; integrated circuit testing; production testing; radiation hardening (electronics); 0.25 micron; WaferTech commercial foundry; commercial flow; commercial process; design-hardening techniques; prompt dose hardened CMOS process; prompt dose hardness; single event effects hardness; Application specific integrated circuits; CMOS process; Fabrication; Flip-flops; Foundries; Minimally invasive surgery; Radiation effects; Radiation hardening; Single event upset; Springs;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Radiation Effects Data Workshop, 2002 IEEE
  • Print_ISBN
    0-7803-7544-0
  • Type

    conf

  • DOI
    10.1109/REDW.2002.1045533
  • Filename
    1045533
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2423753