DocumentCode :
2424089
Title :
A 1.0 V 78 μW reconfigurable ASIC embedded in an intelligent electrode for continuous remote ECG applications
Author :
Yang, Geng ; Chen, Jian ; Jonsson, Fredrik ; Tenhunen, Hannu ; Zheng, Li-Rong
Author_Institution :
Sch. of Inf. & Commun. Technol., KTH-R. Inst. of Technol., Kista-Stockholm, Sweden
fYear :
2009
fDate :
3-6 Sept. 2009
Firstpage :
2316
Lastpage :
2319
Abstract :
In this paper, a reconfigurable, low-power Application Specific Integrated Circuit (ASIC) that extracts and transmits electrocardiograph (ECG) signals is presented. An intelligent electrode is introduced which consists of the proposed ASIC and a micro spike array, permitting onsite ECG signal acquisition, processing and transmission. Fabricated in a standard 0.18 mum CMOS process, the ASIC consumes 78 muW with 1.0 V core voltage at 6 MHz operating frequency and only occupies 2.25 mm2. The tiny silicon size makes it possible and suitable to embed the proposed ASIC into an intelligent electrode, and the low power consumption makes it feasible for long term continuous ECG monitoring.
Keywords :
CMOS integrated circuits; application specific integrated circuits; biomedical electrodes; biomedical electronics; electrocardiography; health care; medical signal processing; patient monitoring; reconfigurable architectures; silicon; CMOS process; continuous remote ECG monitoring; electrocardiograph signal; frequency 6 MHz; health care; intelligent electrode; low-power application specific integrated circuit; micro spike array; power 78 muW; reconfigurable ASIC; signal acquisition; signal processing; signal transmission; size 0.18 mum; voltage 1.0 V; Biomedical Engineering; Computers; Electricity; Electrocardiography; Electrodes; Electronics, Medical; Equipment Design; Heart Rate; Humans; Signal Processing, Computer-Assisted; Silicon; Telemetry;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
Conference_Location :
Minneapolis, MN
ISSN :
1557-170X
Print_ISBN :
978-1-4244-3296-7
Electronic_ISBN :
1557-170X
Type :
conf
DOI :
10.1109/IEMBS.2009.5335120
Filename :
5335120
Link To Document :
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