• DocumentCode
    2424489
  • Title

    A comparative study of some design concepts for mechanically prestressed fiber-reinforced composite insulations

  • Author

    Ding, H.-Z. ; Varlow, B.R.

  • Author_Institution
    Sch. of Eng., Manchester Univ., UK
  • fYear
    2003
  • fDate
    19-22 Oct. 2003
  • Firstpage
    653
  • Lastpage
    656
  • Abstract
    In recent years, the accumulated research evidence in our group has demonstrated that the addition of mechanically prestressed fibers in epoxy resin will strengthen the microstructure and therefore improve the electrical insulation strength of the epoxy resin by increasing the electrical tree growth resistance. In this paper, a comparative study of the effect of some different design concepts on mechanically prestressed insulation is presented. Calculations of the effect of prestress in the resin and the optimized design for the composite insulation are based on fundamental stress analysis. The electrical treeing test results from prestressing specimens with multiple unidirectional and orthogonal fibers clearly demonstrate the beneficial effect of mechanical prestress and that enforced compressive stresses in the resin by optimized prestress design can significantly increase the electrical tree growth time to failure and therefore improve the electrical insulation.
  • Keywords
    composite insulating materials; epoxy insulation; fibre reinforced plastics; internal stresses; stress analysis; trees (electrical); design concepts; electrical insulation; electrical insulation strength; electrical tree growth resistance; electrical tree growth time to failure; epoxy resin; fundamental stress analysis; mechanically prestressed fiber-reinforced composite insulations; microstructure; Acceleration; Compressive stress; Design optimization; Dielectrics and electrical insulation; Electric resistance; Epoxy resins; Microstructure; Residual stresses; Tensile stress; Trees - insulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 2003. Annual Report. Conference on
  • Print_ISBN
    0-7803-7910-1
  • Type

    conf

  • DOI
    10.1109/CEIDP.2003.1254939
  • Filename
    1254939