Designing a parallel algorithm for Heat conduction using MPI, OpenMP and CUDA

Author

Sivanandan, Vinaya ; Kumar, Vikas ; Meher, Srisai

Author_Institution

Centre for Dev. of Adv. Comput., Pune, India

fYear

2015

fDate

19-20 Feb. 2015

Firstpage

1

Lastpage

7

Abstract

A three dimensional (3-D) code based on finite difference method (FDM) has been developed for solving steady state heat conduction equation. The code computes temperature values at discrete number of nodes in the computational domain. The results obtained by the developed code are compared with general purpose CFD software. The code has been made parallel using Message passing interface (MPI), Open Multi-Processing (OpenMP), and Compute Unified Device Architecture (CUDA).

Keywords

computational fluid dynamics; heat conduction; message passing; multiprocessing systems; parallel algorithms; parallel architectures; CUDA; FDM; MPI; OpenMP; computational domain; compute unified device architecture; finite difference method; general purpose CFD software; heat conduction; message passing interface; open multiprocessing; parallel algorithm; steady state heat conduction equation; temperature values; three dimensional code; Frequency division multiplexing; Graphics processing units; Heating; Mathematical model; Message systems; Steady-state; Temperature distribution; CUDA; FDM; GPU; MPI; OpenMP;

fLanguage

English

Publisher

ieee

Conference_Titel

Parallel Computing Technologies (PARCOMPTECH), 2015 National Conference on

Conference_Location

Bangalore

Print_ISBN

978-1-4799-6916-6

Type

conf

DOI

10.1109/PARCOMPTECH.2015.7084516

Filename

7084516