DocumentCode
2425827
Title
Theoretical analysis for low-power test decompression using test-slice duplication
Author
Mu, Szu-Pang ; Chao, Mango C -T
Author_Institution
Dept. of Electron. Eng., Nat. Chiao-Tung Univ., Hsinchu, Taiwan
fYear
2010
fDate
19-22 April 2010
Firstpage
147
Lastpage
152
Abstract
This paper presents a single-test-input test-decompression scheme, named STSD, which utilize the technique of test-slice duplication to reduce the test-data volume as well as the signal transitions along scan paths. The encoding of STSD scheme focuses on maximizing the number of duplications made by a test-slice template. Mathematical models are also developed in this paper to estimate the compression ratio, test-application time, and scan-in transitions caused by STSD scheme, and in turn can further help designers to efficiently identify the best configuration of STSD scheme instead of going through a time-consuming simulation process. The experimental results based on large ISCAS and ITC benchmark circuits demonstrate the accuracy of the proposed mathematical models and the advantages of using STSD scheme.
Keywords
design for testability; integrated circuit testing; low-power electronics; ITC benchmark circuits; STSD scheme; compression ratio; large ISCAS; low power test decompression; scan in transitions; signal transitions; single-test-input test-decompression scheme; test application time; test slice duplication; time consuming simulation; Broadcasting; Buffer storage; Circuit testing; Electronic equipment testing; Encoding; Mathematical model; Power generation; Signal design; Signal generators; Test pattern generators;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Test Symposium (VTS), 2010 28th
Conference_Location
Santa Cruz, CA
ISSN
1093-0167
Print_ISBN
978-1-4244-6649-8
Type
conf
DOI
10.1109/VTS.2010.5469591
Filename
5469591
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