Title :
Theoretical analysis for low-power test decompression using test-slice duplication
Author :
Mu, Szu-Pang ; Chao, Mango C -T
Author_Institution :
Dept. of Electron. Eng., Nat. Chiao-Tung Univ., Hsinchu, Taiwan
Abstract :
This paper presents a single-test-input test-decompression scheme, named STSD, which utilize the technique of test-slice duplication to reduce the test-data volume as well as the signal transitions along scan paths. The encoding of STSD scheme focuses on maximizing the number of duplications made by a test-slice template. Mathematical models are also developed in this paper to estimate the compression ratio, test-application time, and scan-in transitions caused by STSD scheme, and in turn can further help designers to efficiently identify the best configuration of STSD scheme instead of going through a time-consuming simulation process. The experimental results based on large ISCAS and ITC benchmark circuits demonstrate the accuracy of the proposed mathematical models and the advantages of using STSD scheme.
Keywords :
design for testability; integrated circuit testing; low-power electronics; ITC benchmark circuits; STSD scheme; compression ratio; large ISCAS; low power test decompression; scan in transitions; signal transitions; single-test-input test-decompression scheme; test application time; test slice duplication; time consuming simulation; Broadcasting; Buffer storage; Circuit testing; Electronic equipment testing; Encoding; Mathematical model; Power generation; Signal design; Signal generators; Test pattern generators;
Conference_Titel :
VLSI Test Symposium (VTS), 2010 28th
Conference_Location :
Santa Cruz, CA
Print_ISBN :
978-1-4244-6649-8
DOI :
10.1109/VTS.2010.5469591