• DocumentCode
    2425827
  • Title

    Theoretical analysis for low-power test decompression using test-slice duplication

  • Author

    Mu, Szu-Pang ; Chao, Mango C -T

  • Author_Institution
    Dept. of Electron. Eng., Nat. Chiao-Tung Univ., Hsinchu, Taiwan
  • fYear
    2010
  • fDate
    19-22 April 2010
  • Firstpage
    147
  • Lastpage
    152
  • Abstract
    This paper presents a single-test-input test-decompression scheme, named STSD, which utilize the technique of test-slice duplication to reduce the test-data volume as well as the signal transitions along scan paths. The encoding of STSD scheme focuses on maximizing the number of duplications made by a test-slice template. Mathematical models are also developed in this paper to estimate the compression ratio, test-application time, and scan-in transitions caused by STSD scheme, and in turn can further help designers to efficiently identify the best configuration of STSD scheme instead of going through a time-consuming simulation process. The experimental results based on large ISCAS and ITC benchmark circuits demonstrate the accuracy of the proposed mathematical models and the advantages of using STSD scheme.
  • Keywords
    design for testability; integrated circuit testing; low-power electronics; ITC benchmark circuits; STSD scheme; compression ratio; large ISCAS; low power test decompression; scan in transitions; signal transitions; single-test-input test-decompression scheme; test application time; test slice duplication; time consuming simulation; Broadcasting; Buffer storage; Circuit testing; Electronic equipment testing; Encoding; Mathematical model; Power generation; Signal design; Signal generators; Test pattern generators;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Test Symposium (VTS), 2010 28th
  • Conference_Location
    Santa Cruz, CA
  • ISSN
    1093-0167
  • Print_ISBN
    978-1-4244-6649-8
  • Type

    conf

  • DOI
    10.1109/VTS.2010.5469591
  • Filename
    5469591