Title :
Low-cost package technology for advanced MMIC applications
Author :
Chai, S. ; Kirschman, R. ; Ludvik, S. ; Bedinger, J. ; Harmon, L. ; Burkholder, R. ; Fallica, M. ; Tarbox, S. ; Doherty, M. ; Oenning, J. ; Clark, I.
Author_Institution :
Teledyne Monolithic Microwave, Mountain View, CA, USA
Abstract :
The availability of MMICs (monolithic microwave integrated circuits) along with expanded applications for microwave components places increasing demands on performance and cost of package technology. A report is presented on the progress in meeting these demands with metal-injection molding (MIM) of metal-matrix composites for advanced microwave packaging technology. Experiences in developing this technology, including dimensional control, plating, hermeticity, and cost, are given. The electrical performance of packaged multichip amplifiers operating at 2-20 GHz is also described.<>
Keywords :
MMIC; composite materials; microwave amplifiers; packaging; seals (stoppers); 2 to 20 GHz; MMIC; cost; dimensional control; electrical performance; hermeticity; metal-injection molding; metal-matrix composites; multichip amplifiers; package technology; plating; Assembly systems; Bonding; Costs; Electromagnetic heating; MMICs; Microwave technology; Packaging; Powders; Temperature; Thermal conductivity;
Conference_Titel :
Microwave Symposium Digest, 1990., IEEE MTT-S International
Conference_Location :
Dallas, TX
DOI :
10.1109/MWSYM.1990.99657
