Title :
2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320)
Abstract :
The following topics are dealt with: nonvolatile memories; dielectrics; hot carriers; MEMS; assembly/packaging; ESD and latchup; compound semiconductors; failure analysis; product reliability; devices and processes; interconnects; process induced damage; IC survival of germicidal irradiation of US mail.
Keywords :
dielectric thin films; electrostatic discharge; failure analysis; integrated circuit interconnections; integrated circuit metallisation; integrated circuit packaging; integrated circuit reliability; integrated circuit yield; integrated memory circuits; micromechanical devices; radiation effects; random-access storage; ESD; IC germicidal irradiation survival; MEMS; US mail germicidal irradiation; assembly; compound semiconductors; device processes; dielectrics; failure analysis; hot carriers; interconnects; latchup; nonvolatile memories; packaging; process induced damage; product reliability; reliability physics;
Conference_Titel :
Reliability Physics Symposium Proceedings, 2002. 40th Annual
Conference_Location :
Dallas, TX, USA
Print_ISBN :
0-7803-7352-9
DOI :
10.1109/RELPHY.2002.996602
