DocumentCode
2426187
Title
Gate oxide reliability of drain-side stresses compared to gate stresses
Author
Dumin, Nels A. ; Liu, Kaiping ; Yang, Shyh-Homg
Author_Institution
Silicon Technol. Dev., Texas Instrum. Inc., Dallas, TX, USA
fYear
2002
fDate
2002
Firstpage
73
Lastpage
78
Abstract
The gate oxide breakdown voltages of stresses applied to the gates of transistors are compared to the gate oxide breakdown voltages of stresses applied to the drains of transistors. The breakdown voltages for the drain-side stress are shown to be higher than the breakdown voltages for the gate stress. Using TCAD simulation data of a drain-side stress, the differences in breakdown voltages between the drain stresses and the gate stresses are compared to predictions of the gate oxide lifetime for various gate-stress and drain-stress cases.
Keywords
MOSFET; insulating thin films; semiconductor device breakdown; semiconductor device models; semiconductor device reliability; technology CAD (electronics); MOS transistor; TCAD simulation data; drain-side stresses; gate oxide breakdown voltages; gate oxide lifetime; gate oxide reliability; gate stresses; Circuits; Instruments; MOSFETs; Predictive models; Silicon; Stress; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium Proceedings, 2002. 40th Annual
Print_ISBN
0-7803-7352-9
Type
conf
DOI
10.1109/RELPHY.2002.996612
Filename
996612
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