• DocumentCode
    2426187
  • Title

    Gate oxide reliability of drain-side stresses compared to gate stresses

  • Author

    Dumin, Nels A. ; Liu, Kaiping ; Yang, Shyh-Homg

  • Author_Institution
    Silicon Technol. Dev., Texas Instrum. Inc., Dallas, TX, USA
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    73
  • Lastpage
    78
  • Abstract
    The gate oxide breakdown voltages of stresses applied to the gates of transistors are compared to the gate oxide breakdown voltages of stresses applied to the drains of transistors. The breakdown voltages for the drain-side stress are shown to be higher than the breakdown voltages for the gate stress. Using TCAD simulation data of a drain-side stress, the differences in breakdown voltages between the drain stresses and the gate stresses are compared to predictions of the gate oxide lifetime for various gate-stress and drain-stress cases.
  • Keywords
    MOSFET; insulating thin films; semiconductor device breakdown; semiconductor device models; semiconductor device reliability; technology CAD (electronics); MOS transistor; TCAD simulation data; drain-side stresses; gate oxide breakdown voltages; gate oxide lifetime; gate oxide reliability; gate stresses; Circuits; Instruments; MOSFETs; Predictive models; Silicon; Stress; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium Proceedings, 2002. 40th Annual
  • Print_ISBN
    0-7803-7352-9
  • Type

    conf

  • DOI
    10.1109/RELPHY.2002.996612
  • Filename
    996612