Fabrication and testing of large-area flexible electronics for displays and sensor arrays

In this presentation, an overview of low-temperature processing for thin-film transistor array fabrication, using jet-printing, will be given along with the integration of these backplanes with organic and inorganic sensor materials. The approach using jetprinting, or digital lithography, provides an extra degree of freedom for patterning device structures on flexible platforms. This technique allows for real-time monitoring of layer registration and alignment correction using a digital patterning technique. The characterization of low-temperature compatible materials will also be reviewed in regard to conditions that determine device stability and performance in silicon-based devices. A rapid testing strategy that identifies many common defects in flexible backplane arrays will be presented. Finally, an overview of specific applications for flexible backplanes, displays, and image sensor arrays will be given.