DocumentCode
2426289
Title
Innovative practices session 2C: Design, fabrication and test of flexible electronics
Author
Cheng, K.-T.
Author_Institution
UC Santa Barbara
fYear
2010
fDate
19-22 April 2010
Firstpage
81
Lastpage
81
Abstract
The development of inexpensive high-performance electronics requiring low-temperature device processing will enable low-cost, large-area flexible electronics for applications such as large-area displays, sensors, and evolving technologies such as electric paper. The recent developments of thin-film transistor (TFT) backplanes processed on flexible plastic substrates opens the possibility for novel device structures, processes, and applications.
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Test Symposium (VTS), 2010 28th
Conference_Location
Santa Cruz, CA, USA
ISSN
1093-0167
Print_ISBN
978-1-4244-6649-8
Type
conf
DOI
10.1109/VTS.2010.5469613
Filename
5469613
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