DocumentCode :
2426380
Title :
Product-specific ´moisture levels´: a conceptual framework
Author :
Blish, Richard C., II ; Sidharth
Author_Institution :
Adv. Micro Devices Inc., Sunnyvale, CA, USA
fYear :
2002
fDate :
2002
Firstpage :
130
Lastpage :
135
Abstract :
An improved schedule to evaluate SMT popcorn jeopardy based on physics of moisture absorption is proposed. Key features are: each lettered Level implies a certain performance irrespective of package thickness (i.e., no penalty for thinner packages); each successive level has stepped moisture concentration at the interior (i.e. clear stepped discrimination between levels); the time required for preconditioning is substantially reduced from current practice and an acceleration factor can be clearly computed.
Keywords :
integrated circuit packaging; integrated circuit reliability; moisture; surface mount technology; SMT; acceleration factor; clear stepped discrimination; moisture absorption; package thickness; popcorn jeopardy; preconditioning; product-specific moisture levels; stepped moisture concentration; Absorption; Acceleration; Assembly; Building materials; Floors; Job shop scheduling; Moisture; Packaging; Physics; Surface-mount technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium Proceedings, 2002. 40th Annual
Print_ISBN :
0-7803-7352-9
Type :
conf
DOI :
10.1109/RELPHY.2002.996624
Filename :
996624
Link To Document :
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