DocumentCode
2426380
Title
Product-specific ´moisture levels´: a conceptual framework
Author
Blish, Richard C., II ; Sidharth
Author_Institution
Adv. Micro Devices Inc., Sunnyvale, CA, USA
fYear
2002
fDate
2002
Firstpage
130
Lastpage
135
Abstract
An improved schedule to evaluate SMT popcorn jeopardy based on physics of moisture absorption is proposed. Key features are: each lettered Level implies a certain performance irrespective of package thickness (i.e., no penalty for thinner packages); each successive level has stepped moisture concentration at the interior (i.e. clear stepped discrimination between levels); the time required for preconditioning is substantially reduced from current practice and an acceleration factor can be clearly computed.
Keywords
integrated circuit packaging; integrated circuit reliability; moisture; surface mount technology; SMT; acceleration factor; clear stepped discrimination; moisture absorption; package thickness; popcorn jeopardy; preconditioning; product-specific moisture levels; stepped moisture concentration; Absorption; Acceleration; Assembly; Building materials; Floors; Job shop scheduling; Moisture; Packaging; Physics; Surface-mount technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium Proceedings, 2002. 40th Annual
Print_ISBN
0-7803-7352-9
Type
conf
DOI
10.1109/RELPHY.2002.996624
Filename
996624
Link To Document