• DocumentCode
    2426380
  • Title

    Product-specific ´moisture levels´: a conceptual framework

  • Author

    Blish, Richard C., II ; Sidharth

  • Author_Institution
    Adv. Micro Devices Inc., Sunnyvale, CA, USA
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    130
  • Lastpage
    135
  • Abstract
    An improved schedule to evaluate SMT popcorn jeopardy based on physics of moisture absorption is proposed. Key features are: each lettered Level implies a certain performance irrespective of package thickness (i.e., no penalty for thinner packages); each successive level has stepped moisture concentration at the interior (i.e. clear stepped discrimination between levels); the time required for preconditioning is substantially reduced from current practice and an acceleration factor can be clearly computed.
  • Keywords
    integrated circuit packaging; integrated circuit reliability; moisture; surface mount technology; SMT; acceleration factor; clear stepped discrimination; moisture absorption; package thickness; popcorn jeopardy; preconditioning; product-specific moisture levels; stepped moisture concentration; Absorption; Acceleration; Assembly; Building materials; Floors; Job shop scheduling; Moisture; Packaging; Physics; Surface-mount technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium Proceedings, 2002. 40th Annual
  • Print_ISBN
    0-7803-7352-9
  • Type

    conf

  • DOI
    10.1109/RELPHY.2002.996624
  • Filename
    996624