• DocumentCode
    2426600
  • Title

    Phase space profile measurement using an X-ray pinhole camera

  • Author

    Ogata, A. ; Mitsuhashi, T. ; Katsura, T. ; Yamamoto, N. ; Kawamoto, T.

  • Author_Institution
    Nat. Lab. for High Energy Phys., Ibaraki, Japan
  • fYear
    1989
  • fDate
    20-23 Mar 1989
  • Firstpage
    1498
  • Abstract
    Transverse beam profiles in the real (x,y) and phase (y,y) spaces were obtained by an X-ray pinhole camera sensitive to synchrotron radiation in the TRISTAN Accumulation Ring (AR). Vertical Twiss parameters and the vertical and horizontal emittances are derived from the profiles. A pinhole cannot see the whole beam vertically because of the small cone angle of the radiation. Two measurements were made to solve this problem. The first measurement was made by moving the pinhole vertically; the second was made by using a multiple pinhole plate. An image on a fluorescent screen is observed by a CCD (charge coupled device) camera, digitized, and stored. The phase space and the real space profiles are then reconstructed. A nonlinear least-squares program fits the resultant profiles to a two-dimensional Gaussian distribution to derive the Twiss parameters and emittances
  • Keywords
    beam handling equipment; beam handling techniques; particle accelerator accessories; storage rings; TRISTAN Accumulation Ring; X-ray pinhole camera; charge coupled device camera; cone angle; horizontal emittances; multiple pinhole plate; nonlinear least-squares program; phase space profile measurement; synchrotron radiation; transverse beam profiles; two-dimensional Gaussian distribution; vertical Twiss parameters; vertical emittances; Cameras; Charge coupled devices; Charge-coupled image sensors; Copper; Diffraction; Extraterrestrial measurements; Fluorescence; Laboratories; Phase measurement; Synchrotron radiation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Particle Accelerator Conference, 1989. Accelerator Science and Technology., Proceedings of the 1989 IEEE
  • Conference_Location
    Chicago, IL
  • Type

    conf

  • DOI
    10.1109/PAC.1989.73492
  • Filename
    73492