Fabrication and performance of Microplasma Reactor for maskless scanning plasma etching

Author

Zhang, Qiu-Ping ; Wen, Li ; Xiang, Wei-Wei ; Chu, Jia-Ru

Author_Institution

Dept. of Precision Instrum. & Precision Machinery, Univ. of Sci. & Technol. of China, Hefei, China

fYear

2010

fDate

20-23 Jan. 2010

Firstpage

211

Lastpage

214

Abstract

A Microplasma Reactor for maskless micro/nano plasma etching system based on parallel probe actuation is proposed. The microplasma reactor, having (50μm)² or (100μm)² inverted pyramidal hollow cathode and metal/dielectric/metal sandwich structure, is successfully fabricated here. Measurement system is set up to test the electrical and optical property of the device. Experiment results show that the device discharges stably in SF₆, and the breakdown voltages of the device obey Paschen´s law. V-I characteristics of the device for several gas pressures, source voltages, ballast resistors are also presented. Emission spectras of SF₆ at low pressures show F atom lines, which are available for etching silicon and so on.

Keywords

glow discharges; micromechanical devices; microreactors; plasma devices; plasma diagnostics; sandwich structures; sputter etching; Paschen law; V-I characteristics; ballast resistors; breakdown voltages; discharges; electrical property; emission spectra; fluorine atom lines; gas pressures; inverted pyramidal hollow cathode; maskless microplasma etching system; maskless nanoplasma etching system; maskless scanning plasma etching; measurement system; metal-dielectric-metal sandwich structure; microplasma reactor; optical property; parallel probe actuation; source voltages; V-I characteristics; breakdown; microplasma;

fLanguage

English

Publisher

ieee

Conference_Titel

Nano/Micro Engineered and Molecular Systems (NEMS), 2010 5th IEEE International Conference on

Conference_Location

Xiamen

Print_ISBN

978-1-4244-6543-9

Type

conf

DOI

10.1109/NEMS.2010.5592188

Filename

5592188