• DocumentCode
    2426918
  • Title

    Point based rendering algorithm for simulation of photoresist development

  • Author

    Cui, Bin ; Wan, Wanggen ; Tan, Xiaohui ; Huang, Bing

  • Author_Institution
    Sch. of Commun. & Inf. Eng., Shanghai Univ., Shanghai
  • fYear
    2008
  • fDate
    7-9 July 2008
  • Firstpage
    1749
  • Lastpage
    1753
  • Abstract
    The simulation of the photoresist development is one of key step for lithographical simulation which is necessary to integrated circuit fabrication. Traditionally, the simulation results are presented by vertices and polygons which donpsilat adequately support displaying complex scene of point-cloud data. To cope with these problems, we use a hierarchical point-based representation algorithm for rendering. In order to full the gaps during the advance of the surface, we introduce a pre-interpolation algorithm. Meanwhile, we introduce a physical model for photoresist development based on the Dillpsilas algorithm, Kim Model and ray algorithm. The experimental results demonstrate that the development model, the pre-interpolation algorithm and the hierarchical point-based rendering algorithm are effective for development simulation with 3D large-scale visualization in real-time.
  • Keywords
    circuit simulation; integrated circuit technology; interpolation; photoresists; rendering (computer graphics); Dill algorithm; Kim model; hierarchical point-based representation algorithm; integrated circuit fabrication; lithographical simulation; photoresist development simulation; point based rendering algorithm; preinterpolation algorithm; ray algorithm; Circuit simulation; Computational modeling; Etching; Inhibitors; Optical surface waves; Rendering (computer graphics); Resists; Semiconductor device modeling; Surface topography; Visualization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Audio, Language and Image Processing, 2008. ICALIP 2008. International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-1723-0
  • Electronic_ISBN
    978-1-4244-1724-7
  • Type

    conf

  • DOI
    10.1109/ICALIP.2008.4590232
  • Filename
    4590232