DocumentCode
2427011
Title
Simulation of interchip interconnections based on resonant cavity LEDs, plastic optical fibres and CMOS interface circuits
Author
Bockstaele, R. ; Baets, R.
Author_Institution
Dept. of Inf. Technol., Ghent Univ., Belgium
fYear
2000
fDate
24-28 July 2000
Abstract
This paper presents a LabView-based interchip electro-optical parallel interconnect simulator. Such links are a possible solution for the interconnect bottleneck in future digital systems. The links and their characteristics are quite different from the traditional long distance optical links: the components should be small, low-cost, temperature-insensitive and simple; and the latency (the overall signal delay) and power dissipation must be kept under control. This simulator focuses in particular on the modelling of the resonant cavity LED and the performance analysis.
Keywords
CMOS integrated circuits; driver circuits; light emitting diodes; optical interconnections; optical links; optical receivers; telecommunication computing; CMOS integrated drivers; CMOS interface circuits; LabView-based simulator; electro-optical parallel interconnect simulator; eye diagram; interchip interconnections; interconnect bottleneck; latency; modelling; optical receiver; performance analysis; plastic optical fibres; power dissipation; resonant cavity LED; Analytical models; Delay; Digital systems; Optical control; Optical fiber communication; Power dissipation; Power system interconnection; Power system modeling; Resonance; Temperature control;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic-Enhanced Optics, Optical Sensing in Semiconductor Manufacturing, Electro-Optics in Space, Broadband Optical Networks, 2000. Digest of the LEOS Summer Topical Meetings
Conference_Location
Aventura, FL, USA
ISSN
1099-4742
Print_ISBN
0-7803-6252-7
Type
conf
DOI
10.1109/LEOSST.2000.869689
Filename
869689
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