Design of a smart pixel multispectral imaging array using 3D stacked thin film detectors on Si CMOS circuits

Author

Lee, Kahyun ; Seo, S. ; Huang, Shanjin ; Joo, Yongsoo ; Doolittle, W. Alan ; Fike, S. ; Jokerst, N. ; Brooke, M. ; Brown, Andrew

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2000

fDate

24-28 July 2000

Abstract

We discuss the design of a smart multispectral imaging system which can be fabricated with independently optimized detector arrays and Si CMOS circuits, which are stacked in three dimensions on top of one another for complete physical registration of the multispectral image. This smart multispectral imager utilizes the heterogeneous integration of thin film GaN (UV), MCT (MWIR), and Si CMOS circuitry to create an outstanding example of the power of heterogeneous integration for enhancing optical systems using electronic signal processing capabilities.

Keywords

CMOS image sensors; analog-digital conversion; infrared detectors; photodetectors; smart pixels; ultraviolet detectors; 3D stacked thin film detectors; CMOS ADC; MWIR detector; Si CMOS circuits; UV detector; complete physical registration; electronic signal processing capabilities; heterogeneous integration; independently optimized detector arrays; multispectral imaging array; smart pixel; stacked collocated detectors; Design optimization; Detectors; Gallium nitride; Multispectral imaging; Optical films; Optical signal processing; Semiconductor thin films; Sensor arrays; Smart pixels; Thin film circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic-Enhanced Optics, Optical Sensing in Semiconductor Manufacturing, Electro-Optics in Space, Broadband Optical Networks, 2000. Digest of the LEOS Summer Topical Meetings

Conference_Location

Aventura, FL, USA

ISSN

1099-4742

Print_ISBN

0-7803-6252-7

Type

conf

DOI

10.1109/LEOSST.2000.869697

Filename

869697