Title :
A CMOS-MEMS piezoresistive accelerometer with large proof mass
Author :
Haris, Mohd ; Qu, Hongwei
Author_Institution :
Dept. of Electr. & Comput. Eng., Oakland Univ., Rochester, MI, USA
Abstract :
This paper reports a low-cost, high-sensitivity CMOS-MEMS piezoresistive accelerometer with large proof mass. Inherent CMOS polysilicon thin film was utilized as piezoresistive material and full Wheatstone bridge was constructed through easy wiring allowed by three metal layers in CMOS thin films. The device fabrication process consists of a standard CMOS process for sensor configuration and a deep reactive ion etching (DRIE) based post-CMOS microfabrication for MEMS structure release. Bulk single-crystal silicon (SCS) substrate was included in the proof mass to increase sensor sensitivity. With a low operating power of 1.5 mW, the sensitivity was measured as 0.077 mV/g prior to amplification. The sensor was characterized on a magnetic shaker based dynamic test system with a high-end commercial calibrating accelerometer as reference.
Keywords :
CMOS integrated circuits; accelerometers; microfabrication; microsensors; piezoresistive devices; sputter etching; thin films; MEMS; Wheatstone bridge; microfabrication; piezoresistive accelerometer; polysilicon thin film; proof mass; reactive ion etching; sensitivity; single-crystal silicon substrate; standard CMOS process; CMOS-MEMS; Deep Reactive Ion Etching (DRIE); Piezoresistive; Polysilicon;
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2010 5th IEEE International Conference on
Conference_Location :
Xiamen
Print_ISBN :
978-1-4244-6543-9
DOI :
10.1109/NEMS.2010.5592224