DocumentCode
2427401
Title
A CMOS-MEMS piezoresistive accelerometer with large proof mass
Author
Haris, Mohd ; Qu, Hongwei
Author_Institution
Dept. of Electr. & Comput. Eng., Oakland Univ., Rochester, MI, USA
fYear
2010
fDate
20-23 Jan. 2010
Firstpage
309
Lastpage
312
Abstract
This paper reports a low-cost, high-sensitivity CMOS-MEMS piezoresistive accelerometer with large proof mass. Inherent CMOS polysilicon thin film was utilized as piezoresistive material and full Wheatstone bridge was constructed through easy wiring allowed by three metal layers in CMOS thin films. The device fabrication process consists of a standard CMOS process for sensor configuration and a deep reactive ion etching (DRIE) based post-CMOS microfabrication for MEMS structure release. Bulk single-crystal silicon (SCS) substrate was included in the proof mass to increase sensor sensitivity. With a low operating power of 1.5 mW, the sensitivity was measured as 0.077 mV/g prior to amplification. The sensor was characterized on a magnetic shaker based dynamic test system with a high-end commercial calibrating accelerometer as reference.
Keywords
CMOS integrated circuits; accelerometers; microfabrication; microsensors; piezoresistive devices; sputter etching; thin films; MEMS; Wheatstone bridge; microfabrication; piezoresistive accelerometer; polysilicon thin film; proof mass; reactive ion etching; sensitivity; single-crystal silicon substrate; standard CMOS process; CMOS-MEMS; Deep Reactive Ion Etching (DRIE); Piezoresistive; Polysilicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems (NEMS), 2010 5th IEEE International Conference on
Conference_Location
Xiamen
Print_ISBN
978-1-4244-6543-9
Type
conf
DOI
10.1109/NEMS.2010.5592224
Filename
5592224
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