• DocumentCode
    2427401
  • Title

    A CMOS-MEMS piezoresistive accelerometer with large proof mass

  • Author

    Haris, Mohd ; Qu, Hongwei

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Oakland Univ., Rochester, MI, USA
  • fYear
    2010
  • fDate
    20-23 Jan. 2010
  • Firstpage
    309
  • Lastpage
    312
  • Abstract
    This paper reports a low-cost, high-sensitivity CMOS-MEMS piezoresistive accelerometer with large proof mass. Inherent CMOS polysilicon thin film was utilized as piezoresistive material and full Wheatstone bridge was constructed through easy wiring allowed by three metal layers in CMOS thin films. The device fabrication process consists of a standard CMOS process for sensor configuration and a deep reactive ion etching (DRIE) based post-CMOS microfabrication for MEMS structure release. Bulk single-crystal silicon (SCS) substrate was included in the proof mass to increase sensor sensitivity. With a low operating power of 1.5 mW, the sensitivity was measured as 0.077 mV/g prior to amplification. The sensor was characterized on a magnetic shaker based dynamic test system with a high-end commercial calibrating accelerometer as reference.
  • Keywords
    CMOS integrated circuits; accelerometers; microfabrication; microsensors; piezoresistive devices; sputter etching; thin films; MEMS; Wheatstone bridge; microfabrication; piezoresistive accelerometer; polysilicon thin film; proof mass; reactive ion etching; sensitivity; single-crystal silicon substrate; standard CMOS process; CMOS-MEMS; Deep Reactive Ion Etching (DRIE); Piezoresistive; Polysilicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems (NEMS), 2010 5th IEEE International Conference on
  • Conference_Location
    Xiamen
  • Print_ISBN
    978-1-4244-6543-9
  • Type

    conf

  • DOI
    10.1109/NEMS.2010.5592224
  • Filename
    5592224