DocumentCode
2427602
Title
Spectroscopic ellipsometry and reflectometry: a user´s perspective
Author
Tompkins, H.G. ; Baker, J.H. ; Smith, S. ; Convey, D.
Author_Institution
Motorola Lab., Tempe, AZ, USA
fYear
2000
fDate
24-28 July 2000
Abstract
We discuss how analytical tools in a characterization lab can be used to enhance metrology tools in a fab. The emphasis is on the interaction between a characterization lab and a wafer fab belonging to the same industrial company. Specifically this work will deal with ex situ analysis rather than in situ metrology. A metrology tool in a fab must be clean, fast, simple to operate, and must be able to measure small features. A classical example is a reflectometry tool. On the other hand, a tool in a characterization lab can handle a much more complex sample, can take a significantly longer time for the analysis, and often has the luxury of using a blanket wafer. The analyst is also available for consulting with regard to optimum samples configuration in order to generate the information required. Our emphasis will be on using spectroscopic ellipsometry in a characterization lab to develop optical constants of unusual material so that this information can be used in a reflectometry tool in the fab.
Keywords
Ellipsometry; Integrated circuit manufacture; Integrated circuit measurement; Optical constants; Quality control; Reflectometry; Thickness measurement; analytical tools; characterization lab; ex situ analysis; metrology tools; optical constants; optimum samples configuration; quality control; reflectometry tool; spectroscopic ellipsometry; thickness measurement; wafer fab; Ellipsometry; Manufacturing; Metrology; Optical films; Optical materials; Optical refraction; Reflectometry; Silicon; Spectroscopy; Thickness measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic-Enhanced Optics, Optical Sensing in Semiconductor Manufacturing, Electro-Optics in Space, Broadband Optical Networks, 2000. Digest of the LEOS Summer Topical Meetings
Conference_Location
Aventura, FL, USA
ISSN
1099-4742
Print_ISBN
0-7803-6252-7
Type
conf
DOI
10.1109/LEOSST.2000.869717
Filename
869717
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