Extracting Thermal Data from High Power MCM Packages

An experimental method was presented for characterizing the thermal performance of multi-chip modules (MCMs) using different size heat sinks. A flip chip package, having a total of five active components, was tested at various power level combinations using a flow bench test facility to supply air flow at a controlled velocity. A linear superposition model, developed for each sink, accurately predicted junction temperatures for a range of power combinations and flow velocities. For the specific package and range of power conditions tested, a more general empirically based model predicted junction temperatures as a function of heat sink size, flow velocity and power level combinations.