• DocumentCode
    2428458
  • Title

    High-Level Packaging Options for Outdoor Remote Units

  • Author

    Shabany, Younes

  • Author_Institution
    Flextronics Int., San Jose, CA
  • fYear
    2007
  • fDate
    18-22 March 2007
  • Firstpage
    18
  • Lastpage
    23
  • Abstract
    Thermal performance of three high-level packaging options for natural convection and radiation cooled outdoor remote units was investigated in this work. Analytical correlations were used to determine required number and size of the fins. Then, a computational fluid dynamic simulation tool was used to investigate detailed thermal performance of three packaging options with the limitation that they use same fin and base areas. It was shown that all three designs perform almost the same if solar load is applied on the unit. However, the cube design performs worse than the narrow-deep and wide-slim designs if no solar load is applied.
  • Keywords
    computational fluid dynamics; cooling; heat sinks; natural convection; thermal management (packaging); analytical correlations; computational fluid dynamic simulation tool; cube design; fins size; high-level packaging options; narrow-deep design; natural convection cooling; natural radiation cooling; outdoor remote units; solar load; thermal performance; wide-slim design; Base stations; Electronic packaging thermal management; Heat sinks; Heat transfer; Solar heating; Surface resistance; Thermal conductivity; Thermal expansion; Thermal loading; Thermal resistance; Thermal performance; natural convection; outdoor remote units; packaging; radiation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2007. SEMI-THERM 2007. Twenty Third Annual IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    1065-2221
  • Print_ISBN
    1-4244-09589-4
  • Electronic_ISBN
    1065-2221
  • Type

    conf

  • DOI
    10.1109/STHERM.2007.352387
  • Filename
    4160881