DocumentCode
2428458
Title
High-Level Packaging Options for Outdoor Remote Units
Author
Shabany, Younes
Author_Institution
Flextronics Int., San Jose, CA
fYear
2007
fDate
18-22 March 2007
Firstpage
18
Lastpage
23
Abstract
Thermal performance of three high-level packaging options for natural convection and radiation cooled outdoor remote units was investigated in this work. Analytical correlations were used to determine required number and size of the fins. Then, a computational fluid dynamic simulation tool was used to investigate detailed thermal performance of three packaging options with the limitation that they use same fin and base areas. It was shown that all three designs perform almost the same if solar load is applied on the unit. However, the cube design performs worse than the narrow-deep and wide-slim designs if no solar load is applied.
Keywords
computational fluid dynamics; cooling; heat sinks; natural convection; thermal management (packaging); analytical correlations; computational fluid dynamic simulation tool; cube design; fins size; high-level packaging options; narrow-deep design; natural convection cooling; natural radiation cooling; outdoor remote units; solar load; thermal performance; wide-slim design; Base stations; Electronic packaging thermal management; Heat sinks; Heat transfer; Solar heating; Surface resistance; Thermal conductivity; Thermal expansion; Thermal loading; Thermal resistance; Thermal performance; natural convection; outdoor remote units; packaging; radiation;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 2007. SEMI-THERM 2007. Twenty Third Annual IEEE
Conference_Location
San Jose, CA
ISSN
1065-2221
Print_ISBN
1-4244-09589-4
Electronic_ISBN
1065-2221
Type
conf
DOI
10.1109/STHERM.2007.352387
Filename
4160881
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