DocumentCode
2428524
Title
Thermal Considerations for LED Components in an Automotive Lamp
Author
Bielecki, Joseph ; Jwania, Ahmad Sameh ; Khatib, Fadi El ; Poorman, Thomas
Author_Institution
North American Lighting Inc., Farmington Hills, MI
fYear
2007
fDate
18-22 March 2007
Firstpage
37
Lastpage
43
Abstract
LED´s in automotive lamp applications have been utilized effectively for functions with low light output requirements and for styling purposes. In recent years, high to ultra high power LED´s are becoming a light source option for virtually every automotive lighting system. For exterior automotive lighting, these light sources have distinct advantages, but also unique thermal issues compared to conventional incandescent light sources. This study describes two methods of determining the junction temperature of an LED or array of LED´s, direct and indirect. Both are based on temperature measurements, but the indirect method also requires a thermal resistance specified by the manufacturer. The direct method utilizes the intrinsic behavior of the junction voltage drop at low current (<0.1mA). A computer model for a typical plate finned heat sink design for a high power LED automotive lamp was experimentally calibrated. Design of experiment analysis was performed using a 3 level 3 input factor full factorial test matrix. The factors were defined as an active heat sink surface area, convection coefficient correlated to an airflow, and environment temperature. A quadratic model is generated from the results of the factors and significant interactions to the response.
Keywords
LED lamps; automotive electronics; design of experiments; heat sinks; light sources; lighting; thermal management (packaging); LED components; automotive lamp; automotive lighting system; heat sink design; junction temperature; light source; plate finned heat sink; temperature measurements; thermal considerations; thermal resistance; Automotive engineering; Heat sinks; Light emitting diodes; Light sources; Low voltage; Manufacturing; Performance analysis; Performance evaluation; Temperature measurement; Thermal resistance; DOE; LED; automotive lighting; heat sink design; junction temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 2007. SEMI-THERM 2007. Twenty Third Annual IEEE
Conference_Location
San Jose, CA
ISSN
1065-2221
Print_ISBN
1-4244-09589-4
Electronic_ISBN
1065-2221
Type
conf
DOI
10.1109/STHERM.2007.352403
Filename
4160884
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