• DocumentCode
    2428798
  • Title

    Materials processing applications of moderate energy, pulsed electron beams

  • Author

    Hubbard, R.F. ; Fisher, Amnon ; Fliflet, A. ; Ayers, J. ; Golden, J.

  • Author_Institution
    Div. of Plasma Phys., Naval Res. Lab., Washington, DC, USA
  • fYear
    1995
  • fDate
    5-8 June 1995
  • Firstpage
    284
  • Abstract
    Summary form only given, as follows. Intense, pulsed electron and ion beams with very high peak power have been available for over two decades, but these devices have generally not been suitable for industrial applications such as materials processing. Such applications generally require repetitively-pulsed beam sources with high average power. A number of potential applications have been identified for pulsed electron and ion beams, but the primary emphasis has been on high energy (/spl ges/1 MeV) and short pulse lengths (/spl les/0.1 /spl mu/sec). This report examines potential applications for pulsed electron beams with lower energies but much longer pulse lengths (/spl ges/1 /spl mu/sec). The applications include thin film deposition, bonding of dissimilar materials, production of fine-grained materials such as nanocrystalline ceramics, and surface modification. Preliminary experimental results illustrating a novel multi-layer bonding process are presented.
  • Keywords
    adhesion; ceramics; electron beam applications; electron beam deposition; electron beams; nanostructured materials; nanotechnology; surface treatment; 0.1 mus; 1 MeV; 1 mus; bonding; dissimilar materials; fine-grained materials; high average power; industrial applications; ion beams; materials processing; materials processing applications; moderate energy electron beams; multi-layer bonding process; nanocrystalline ceramics; pulse lengths; pulsed electron beams; repetitively-pulsed beam sources; surface modification; thin film deposition; Electron beams; Ion beams; Laboratories; Materials processing; Particle beams; Physics; Plasma applications; Plasma devices; Plasma materials processing; Welding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Science, 1995. IEEE Conference Record - Abstracts., 1995 IEEE International Conference on
  • Conference_Location
    Madison, WI, USA
  • ISSN
    0730-9244
  • Print_ISBN
    0-7803-2669-5
  • Type

    conf

  • DOI
    10.1109/PLASMA.1995.533533
  • Filename
    533533