• DocumentCode
    2429147
  • Title

    Non-destructive current measurement for surface mounted power MOSFET on VRM board using magnetic field probing technique

  • Author

    Ikeda, Yoshiko ; Yamaguchi, Yoshihiro ; Kawaguchi, Yusuke ; Yamaguchi, Masakazu ; Omura, Ichiro ; Domon, Tomokazu

  • Author_Institution
    Semicond. Co., Toshiba Corp., Kawasaki, Japan
  • fYear
    2009
  • fDate
    14-18 June 2009
  • Firstpage
    65
  • Lastpage
    68
  • Abstract
    This paper proposes nondestructive current measurement for surface mounted power MOSFET on VRM board using the micro-magnetic probing technique to facilitation discussion of the self-turn-on phenomenon. A notable feature of the proposed technique is that the sensor part is much smaller than that of conventional methods because this method measures the intensity of a partial magnetic field caused by wire bonding inductance, whereas the conventional method employs a loop coil structure around the current flow. The small sense part enables measurement of the VRM board itself just by setting the magnetic probe on the MOSFET package. A calibration technique is introduced to reproduce current waveform and we confirm that the obtained current waveform agrees with that obtained by the conventional Current Transformer. Using the proposed technique, we successfully detect shoot through current waveform for high-side power MOSFET during self-turn-on phenomenon in VRM board. We also sense non-uniform current flow among 3 parallel low-side power MOSFETs caused by board layout location. This study demonstrates the capability of sensing VRM board transient current and indicates the importance of board GND layout distribution behavior in determining highly accurate trade-off between switching loss and self-turn-on loss.
  • Keywords
    calibration; electric current measurement; lead bonding; micromagnetics; power MOSFET; board transient current; calibration technique; current transformer; current waveform; high-side power MOSFET; loop coil structure; micromagnetic probing technique; nondestructive current measurement; self-turn-on loss; surface mounted power MOSFET; switching loss; wire bonding inductance; Bonding; Current measurement; Fluid flow measurement; Inductance measurement; MOSFET circuits; Magnetic field measurement; Magnetic sensors; Power MOSFET; Sensor phenomena and characterization; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices & IC's, 2009. ISPSD 2009. 21st International Symposium on
  • Conference_Location
    Barcelona
  • ISSN
    1943-653X
  • Print_ISBN
    978-1-4244-3525-8
  • Electronic_ISBN
    1943-653X
  • Type

    conf

  • DOI
    10.1109/ISPSD.2009.5158002
  • Filename
    5158002