• DocumentCode
    2429239
  • Title

    An in vitro system for modeling brain reactive responses and changes in neuroprosthetic device impedance

  • Author

    Frampton, John P. ; Hynd, Mathew R. ; Vargun, Aytekin ; Roysam, Badri ; Shain, William

  • Author_Institution
    Dept. of Biomed. Sci., State Univ. of New York at Albany, Albany, NY, USA
  • fYear
    2009
  • fDate
    3-6 Sept. 2009
  • Firstpage
    7155
  • Lastpage
    7158
  • Abstract
    Currently available methods for analyzing the structural properties of neural tissue are limited by the frequency at which data can be collected and by the need to sacrifice the specimen to correlate histology with other data. Electrical impedance spectroscopy (EIS) can be used to complement conventional histological and imaging-based methods by measuring real-time electrical data that can be ascribed to changes in tissue composition and structure. This report describes an impedance-based method for the analysis and modeling of the electrical properties of three-dimensional neural tissue constructs in vitro. This model system was used to assess the effects of cell density, type and organization on neuroprosthetic device electrode performance.
  • Keywords
    bioelectric phenomena; biomedical electrodes; brain; cellular biophysics; electric impedance measurement; neurophysiology; prosthetics; 3D neural tissue construct electrical properties; brain reactive response modeling; cell density effects; cell organization effects; cell type effects; electrical impedance spectroscopy; impedance based method; in vitro system; neural tissue structural properties; neuroprosthetic device electrode performance; neuroprosthetic device impedance changes; Animals; Biomedical Engineering; Brain; Cells, Cultured; Electric Impedance; Electrodes, Implanted; Electrophysiological Phenomena; Microelectrodes; Models, Neurological; Prostheses and Implants; Spectrum Analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
  • Conference_Location
    Minneapolis, MN
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-3296-7
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2009.5335352
  • Filename
    5335352