Thin film RF module design for high volume applications

Module solutions using integrated passive components are key elements in the quest for the constant size and cost reduction demanded by high volume mobile system manufacturers. Thin film on glass panel module technology is now available in the marketplace, offering economies of scale with high performance. The high level of integration means that the passive components have to be designed as an integral part of the system. Historically, this has been an obstacle to the widespread use of integrated passive module technology, particularly due to the lack of detailed models of the component performance at high frequencies. This paper describes a design kit which allows the accurate design of thin film modules for RF high volume applications. This is illustrated through the design of a 2.45 GHz VCO for a wireless LAN application